发明名称 EPOXY RESIN COMPOSITION AND PREPREG MADE WITH THE EPOXY RESIN COMPOSITION
摘要 <p>A two-stage-curable epoxy resin composition which comprises (a) an epoxy resin, (b) a latent hardener having the ability to harden at 100 DEG C or lower, and (c) an aromatic amine hardener and/or alicyclic amine hardener and optionally further contains (d) a hardening accelerator; and a prepreg obtained by infiltrating the epoxy resin composition into a fibrous reinforcement. The composition primarily cures at a low temperature to give a demoldable cured article and secondarily cures to give a cured article having high heat resistance. It has satisfactory stability at room temperature.</p>
申请公布号 WO0181445(A1) 申请公布日期 2001.11.01
申请号 WO2001JP03410 申请日期 2001.04.20
申请人 MITSUBISHI RAYON CO., LTD.;GOTO, KAZUYA;HAYASHI, SHIGETSUGU;SAITO, TADAYOSHI;KANEKO, TAKASHI;MITANI, KAZUTAMI;WAKABAYASHI, KOKI;TAKAGI, YASUO 发明人 GOTO, KAZUYA;HAYASHI, SHIGETSUGU;SAITO, TADAYOSHI;KANEKO, TAKASHI;MITANI, KAZUTAMI;WAKABAYASHI, KOKI;TAKAGI, YASUO
分类号 C08G59/18;C08G59/32;C08G59/50;(IPC1-7):C08G59/40;C08J5/24 主分类号 C08G59/18
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