发明名称 |
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
摘要 |
An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.
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申请公布号 |
US2001036793(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
US20010874086 |
申请日期 |
2001.06.04 |
申请人 |
APPLIED MATERIALS, INC., A DELAWARE CORPORATION |
发明人 |
WISWESSER ANDREAS NORBERT;PAN JUDON TONY;SWEDEK BOGUSLAW |
分类号 |
B24B37/04;B24B49/04;B24B49/12;G01B11/06;H01L21/321;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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