| 发明名称 |
Methods for chemical-mechanical polishing of semiconductor wafers |
| 摘要 |
Method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of abrasive particles which contact the wafer surface in combination with a reactive liquid solution essentially free of abrasive particles wherein the ionic strength of the solution is changed to effect a change in polishing.
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| 申请公布号 |
US2001036798(A1) |
申请公布日期 |
2001.11.01 |
| 申请号 |
US20010833309 |
申请日期 |
2001.04.12 |
| 申请人 |
OLIVER MICHAEL R. |
发明人 |
OLIVER MICHAEL R.;MELBOURNE LEE;JAMES DAVID B;BUDINGER WILLIAM D |
| 分类号 |
B24B37/04;B24B41/047;B24B57/02;B24D3/28;B24D3/34;B24D13/10;B24D13/14;G11B23/00;H01L21/306;(IPC1-7):B24B1/00;B24B7/19 |
主分类号 |
B24B37/04 |
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