发明名称 |
Resin-sealed chip stack type semiconductor device |
摘要 |
A resin-sealed chip stack type semiconductor device comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each other, and a sealing resin which covers and protects all the components mounted on the substrate. The non-conductive bonding layer is provided by die bonding in such a manner that is at least covers the portion of the bottom chip where the corresponding wires are connected and does not allow generation of a gap between the two chips.
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申请公布号 |
US2001035587(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
US20010781237 |
申请日期 |
2001.02.13 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KONDO TAKASHI;BANDO KOJI;SHIBATA JUN;NARUTAKI KAZUKO |
分类号 |
H01L23/12;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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