| 摘要 |
Methods and apparatuses are provided that remove a scrubber brush from contact with a wafer surface prior to slowing down the scrubber brush's rotational rate. The scrubbing method may comprise rotating a scrubber brush at a non-reduced rate, while the scrubber brush is in contact with the wafer and removing the scrubber brush from contact with the wafer while rotating the scrubber brush at the non-reduced rate. The scrubbing apparatus has a controller programmed to perform the scrubbing method.
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