发明名称 |
METHOD AND PRODUCTION OF A SENSOR |
摘要 |
The invention relates to a method for producing a sensor (1), wherein a carrier chip (2) is produced. Said chip is provided with a sensor structure (3) comprising an active sensor surface (4). A material (9) capable of flowing is applied onto carrier chips (2) in such a way that the sensor structure (3) has a thinner layer thickness on said active sensor surface (4) than on the area of the carrier chip (2) which borders on the active sensor surface (4). The material (9) which is capable of flowing is hardened thereafter. The hardened material (9) is subsequently removed by chemical means from the surface which faces said carrier chip (2) until the active sensor surface of the sensor structure is layed bare. |
申请公布号 |
WO0142766(A3) |
申请公布日期 |
2001.11.01 |
申请号 |
WO2000EP12338 |
申请日期 |
2000.12.07 |
申请人 |
MICRONAS GMBH;IGEL, GUENTER;ROGALLA, MARKUS |
发明人 |
IGEL, GUENTER;ROGALLA, MARKUS |
分类号 |
H01L21/56;H01L31/0203;H01L31/0232 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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