| 摘要 |
A stackable integrated circuit chip package comprising a flex circuit. The flex circuit itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces, and a conductive pattern which is disposed on the bottom surface. The chip package further comprises a frame which is attached to the substrate of the flex circuit, and an integrated circuit chip which is at least partially circumvented by the frame and electrically connected to the conductive pattern. The substrate is wrapped about and attached to at least a portion of the frame such that the conductive pattern defines first and second portions which are each electrically connectable to another stackable integrated circuit chip package.
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