发明名称 POLYMER STUD GRID ARRAY HAVING FEEDTHROUGHS AND METHOD FOR PRODUCING A SUBSTRATE FOR A POLYMER STUD GRID ARRAY OF THIS TYPE
摘要 The invention relates to a polymer stud grid array having feedthroughs and to a method for producing a substrate for a polymer stud grid array of this type. During injection molding or hot stamping of the substrate (S) for a polymer stud grid array, polymer protuberances (PS) are formed on the underside (U) and recesses (V1) are formed on the top side (O) or on the underside (U). Through holes (DL1) are placed in the bottoms (B1) of the recesses (V1), especially by means of laser boring, in order to form feedthrough holes. The feedthrough holes are produced quickly and with little effort.
申请公布号 WO0182372(A1) 申请公布日期 2001.11.01
申请号 WO2001DE00679 申请日期 2001.02.21
申请人 SIEMENS AKTIENGESELLSCHAFT;KEILHOLZ, KARL-HEINZ;MUELLER, LOTHAR;STRIEBEL, DIRK;THELEN, RICHARD;VAN PUYMBROECK, JOZEF 发明人 KEILHOLZ, KARL-HEINZ;MUELLER, LOTHAR;STRIEBEL, DIRK;THELEN, RICHARD;VAN PUYMBROECK, JOZEF
分类号 B23K26/384;H01L21/48;H01L23/13;H01L23/14;H01L23/498;H05K1/11;H05K3/00;H05K3/34;(IPC1-7):H01L23/13 主分类号 B23K26/384
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