POLYMER STUD GRID ARRAY HAVING FEEDTHROUGHS AND METHOD FOR PRODUCING A SUBSTRATE FOR A POLYMER STUD GRID ARRAY OF THIS TYPE
摘要
The invention relates to a polymer stud grid array having feedthroughs and to a method for producing a substrate for a polymer stud grid array of this type. During injection molding or hot stamping of the substrate (S) for a polymer stud grid array, polymer protuberances (PS) are formed on the underside (U) and recesses (V1) are formed on the top side (O) or on the underside (U). Through holes (DL1) are placed in the bottoms (B1) of the recesses (V1), especially by means of laser boring, in order to form feedthrough holes. The feedthrough holes are produced quickly and with little effort.
申请公布号
WO0182372(A1)
申请公布日期
2001.11.01
申请号
WO2001DE00679
申请日期
2001.02.21
申请人
SIEMENS AKTIENGESELLSCHAFT;KEILHOLZ, KARL-HEINZ;MUELLER, LOTHAR;STRIEBEL, DIRK;THELEN, RICHARD;VAN PUYMBROECK, JOZEF
发明人
KEILHOLZ, KARL-HEINZ;MUELLER, LOTHAR;STRIEBEL, DIRK;THELEN, RICHARD;VAN PUYMBROECK, JOZEF