发明名称 THERMAL PROCESSING SYSTEM AND THERMAL PROCESSING METHOD
摘要 A thermal processing system according to the present invention heats a to-be-processed object while rotating the to-be-processed object by a placement part, and performs thermal processing on the to-be-processed object by supplying a predetermined gas into a processingchamber. This system includes: an outer ring part provided outside of the processing chamber, and having a plurality of magnetic poles arranged circumferentially; an inner ring part provided inside of the processing chamber, having a plurality of magnetic poles arranged circumferentially for applying magnetic forces between the magnetic poles of the outer ring part and those of the inner ring part so as to follow the outer ring part and rotate therewith; a bearing part provided between the inner ring part and processing chamber; and the placement part rotating together with the inner ring part in the processing chamber, wherein the number of the magnetic poles of the outer ring part and inner ring part is determined such that a torque transmitted to the inner ring part from the outer ring part is larger than a friction torque generated by the bearing part when the outer ring part is rotated for a required allowable angular error in orientation of the inner ring part with respect to the outer ring part.
申请公布号 WO0182341(A1) 申请公布日期 2001.11.01
申请号 WO2001JP03277 申请日期 2001.04.17
申请人 TOKYO ELECTRON LIMITED;LI, YICHENG 发明人 LI, YICHENG
分类号 F16C19/06;C23C16/44;H01L21/00;H01L21/205;H01L21/26;H01L21/68 主分类号 F16C19/06
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