| 发明名称 |
CURABLE RESIN COMPOSITION, CURED FILM, AND COMPOSITE PRODUCT |
| 摘要 |
<p>A curable resin composition comprising (A) reactive particles prepared by bonding (A1) at least one of oxide particles of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, ruthenium, rhenium, silver, nickel, cupper and cerium, and (A2) an organic compound which comprises a polymerizable unsaturated group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, and optionally (C) a terminal reactive polysiloxane compound having at least one polymerizable group, other than organic compound (A2).</p> |
| 申请公布号 |
WO0181466(A1) |
申请公布日期 |
2001.11.01 |
| 申请号 |
WO2001NL00304 |
申请日期 |
2001.04.17 |
| 申请人 |
DSM N.V.;JSR CORPORATION;JAPAN FINE COATINGS CO., LTD.;YAMAGUCHI, YOSHIKAZU;NISHIWAKI, ISAO;ERIYAMA, YUICHI;UKACHI, TAKASHI;YASHIRO, TAKAO;TAKAHASHI, MICHIKO |
发明人 |
YAMAGUCHI, YOSHIKAZU;NISHIWAKI, ISAO;ERIYAMA, YUICHI;UKACHI, TAKASHI;YASHIRO, TAKAO;TAKAHASHI, MICHIKO |
| 分类号 |
C08F283/12;C08F290/06;C08L51/08;C08L51/10;C09D151/08;C09D151/10;(IPC1-7):C08L51/10;C09D133/04;C08K3/00;C09D4/00;C09D183/04;C07F7/18 |
主分类号 |
C08F283/12 |
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