发明名称 Local etching apparatus and local etching method
摘要 A local etching apparatus and local etching method improving the throughput of the local etching apparatus by preheating a discharge tube before ignition of the plasma discharge. The local etching apparatus is provided with a plasma generator 1, an alumina discharge tube 2, and a heater 6. The heater 6 is constituted by a heating wire 60, a power source 61 for supplying voltage to the heating wire 60, and a voltage regulator 62 for controlling the voltage supplied from the power source 61 to the heating wire 60. Due to this, it is possible to heat the alumina discharge tube 2 to the desired temperature by the heater 6 immediately before the plasma discharge by the plasma generator 1. As a result, there is no need to wait with the local etching work until the alumina discharge tube 2 rises in temperature to the desired temperature due to the heat by the plasma discharge, that is, it is possible to perform the local etching work immediately after the plasma discharge.
申请公布号 US2001036741(A1) 申请公布日期 2001.11.01
申请号 US20010808520 申请日期 2001.03.14
申请人 TANAKA CHIKAI;YANAGISAWA MICHIHIKO 发明人 TANAKA CHIKAI;YANAGISAWA MICHIHIKO
分类号 H01L21/302;C23F4/00;H01J37/32;H01L21/00;H01L21/3065;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/302
代理机构 代理人
主权项
地址