发明名称 |
CHIP MOUNTING DEVICE AND METHOD OF ADJUSTING PARALLELISM IN THE CHIP MOUNTING DEVICE |
摘要 |
<p>A method of adjusting a parallelism in a chip mounting device, comprising the steps of measuring a parallelism between a chip or a head holding the chip and a substrate or a substrate holding stage holding the substrate for a plurality of corresponding positions between the chip or head and the substrate or substrate holding stage, or for each head when the head is changed automatically, calculating the amount of correction of the parallelism for storing the measured parallelism in a target accuracy range, and correcting the parallelism based on the calculated amount of correction of the parallelism, whereby, when a plurality of chips are mounted on the substrate at multiple positions or the chip mounting device having a function to change the head automatically is used, the parallelism can be adjusted automatically for each mounting position or for each head.</p> |
申请公布号 |
WO0182674(A1) |
申请公布日期 |
2001.11.01 |
申请号 |
WO2001JP03406 |
申请日期 |
2001.04.20 |
申请人 |
TORAY ENGINEERING CO., LTD.;ARAI, YOSHIYUKI;YAMAUCHI, AKIRA;KINOSHITA, YOSHIHIRO |
发明人 |
ARAI, YOSHIYUKI;YAMAUCHI, AKIRA;KINOSHITA, YOSHIHIRO |
分类号 |
H01L21/60;H05K13/04;(IPC1-7):H05K13/04 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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