| 发明名称 |
Semiconductor device and process for fabrication thereof |
| 摘要 |
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
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| 申请公布号 |
US2001035533(A1) |
申请公布日期 |
2001.11.01 |
| 申请号 |
US20010785194 |
申请日期 |
2001.02.20 |
| 申请人 |
TAKEDA SHINJI;MASUKO TAKASHI;YUSA MASAMI;KIKUCHI TOORU;MIYADERA YASUO;MAEKAWA IWAO;YAMASAKI MITSUO;KAGEYAMA AKIRA;KANEDA AIZOU |
发明人 |
TAKEDA SHINJI;MASUKO TAKASHI;YUSA MASAMI;KIKUCHI TOORU;MIYADERA YASUO;MAEKAWA IWAO;YAMASAKI MITSUO;KAGEYAMA AKIRA;KANEDA AIZOU |
| 分类号 |
H01L21/58;H01L23/495;(IPC1-7):H01L29/866;H01L29/88;H01L23/02 |
主分类号 |
H01L21/58 |
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