| 摘要 |
The invention concerns a method and a device for treating a substrate of an integrated circuit or the like during production. The invention is characterised in that it consists in spraying, from the bottom upwards, a treatment liquid (24) on the surface to be treated (20I), facing downwards, of said substrate (20) and transducers (8) apply ultrasonic waves to said substrate (20) via said spayed treatment liquid (24). |
