发明名称 SLICER DEVICE
摘要 PROBLEM TO BE SOLVED: To easily dispose of cut chips when sample holders are arranged in two positions in a slicer device repeatedly slicing a sample surface layer part and sequentially recording an image and the like of the cross sectional face. SOLUTION: A cutter 11 rotates in a plane vertical to a rotary shaft 15. On the bottom face of a machining chamber 21, sample holders 25a, 25b are arranged opposedly to each other while putting the rotary shaft 15 between them. Samples 10a, 10b are held on the sample holders 25a, 25b individually. On the bottom face inside the machining chamber 1, a cut chip collecting tank 27 is arranged in a part close to the front face of the device adjacently to both of the sample holders 25a, 25b. An image and the like of the cross sectional face is taken in while the sample is held in either of the sample holders 25a, 25b. When the sample holder 25a is used, the cutter 11 is turned clockwise, while the cutter 11 is turned counterclockwise when the sample holder 25b is used. Generated chips are collected into the collecting tank 27 in either case.
申请公布号 JP2001305029(A) 申请公布日期 2001.10.31
申请号 JP20000128196 申请日期 2000.04.27
申请人 TOSHIBA MACH CO LTD 发明人 OTOMO AKIHIRO;KOKUBO MITSUNORI
分类号 G01N33/48;B26D3/28;G01N1/28;G01N21/17;(IPC1-7):G01N1/28 主分类号 G01N33/48
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