发明名称 NEW RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition comprising a polyphenylene ether, an inorganic filler, and optionally a polyamide resin and capable of giving a cured product improved in surface appearance and heat resistance. SOLUTION: Provided is a resin composition comprising a functionalized polyphenylene ether resin, an inorganic filler, and optionally a polyamide resin, wherein the functionalized polyphenylene ether resin is functionalized in a solid phase without melting it.
申请公布号 JP2001302904(A) 申请公布日期 2001.10.31
申请号 JP20000125080 申请日期 2000.04.26
申请人 ASAHI KASEI CORP 发明人 MIYOSHI TAKAAKI;HASHIMOTO KAZUHIKO
分类号 C08L71/12;C08K3/00;C08K3/04;C08K3/34;C08K5/00;C08K7/06;C08K7/14;C08L77/00;(IPC1-7):C08L71/12 主分类号 C08L71/12
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