发明名称 POLYPHENYLENE ETHER RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyphenylene ether resin composition improved in adhesion to an inorganic filler without detriment to color tone, appearance, and electrical properties. SOLUTION: Provided is a resin composition prepared by compounding 100 pts.wt. resin composition containing, as the basic resin components, 99-0 pt.wt. (A) polyphenylene ether, 1-100 pts.wt. (B) functionalized polyphenylene ether resin obtained by reacting a mixture prepared by adding 0.01-10.0 pts. wt. modifier selected from conjugated non-aromatic diene compounds, dienophile compounds having one dienophile group, and precursors of the diene or dienophile compounds to 100 pts.wt. component A at a reaction temperature of room temperature to the melting point of component A with 0-50 pts.wt. flame retardant and 10-200 pts.wt. inorganic filler.
申请公布号 JP2001302903(A) 申请公布日期 2001.10.31
申请号 JP20000123501 申请日期 2000.04.25
申请人 ASAHI KASEI CORP 发明人 OZEKI TOSHIAKI;MAEDA MUTSUMI
分类号 C08L71/12;C08K3/00;C08K3/34;C08K3/40;C08K5/00;C08K7/14;C08L25/04;(IPC1-7):C08L71/12 主分类号 C08L71/12
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