发明名称 |
Chromated zinc coated copper foil |
摘要 |
A copper foil - for printed circuit boards - which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability comprises a first layer formed by applying 12 to 50 mg/m<SP>2</SP> of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m<SP>2</SP> of chromium and, if necessary, 1.5 to 6 mg/m<SP>2</SP> of phosphorus. The process of treating the surface of copper foil for printed circuit boards comprising the steps of forming the first layer composed of a sulfur-contained zinc alloy by electrolysis by dipping at least the surface on one side of the copper foil in a solution containing a zinc compound and a sulfur compound and forming the second layer composed of chromate by electrolysis by dipping said first layer in a solution containing a chromium compound, or a chromium compound and a phosphorus compound. |
申请公布号 |
GB2361714(A) |
申请公布日期 |
2001.10.31 |
申请号 |
GB20010009942 |
申请日期 |
2001.04.23 |
申请人 |
* FUKUDA METAL FOIL & POWDER CO LTD |
发明人 |
MASARU * HIROSE;MASASTO * TAKAMI |
分类号 |
C25D3/56;C25D11/36;C25D11/38;H05K3/24;H05K3/38;(IPC1-7):C25D11/38;C25D3/22 |
主分类号 |
C25D3/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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