发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To cut a cutting plane line on a plate glass or a liquid crystal panel in a leaning posture. SOLUTION: This cutting device comprises a carrying-in device A for carrying an object substance X to be cut in a leaning posture by holding the lower edge by a conveyor 1, a receiving conveyor 5 for receiving and holding the lower edge of the object substance in the leaning posture in front of the carrying-in device, a traveling body B running to move between the carrying-in device and the front and sucking and holding the rear face of the object substance on the receiving conveyor and a first cutter running in vertical directions during intermittent stopping of the traveling body, and a cutting plane line is provided on the object substance in the leaning posture.
申请公布号 JP2001302264(A) 申请公布日期 2001.10.31
申请号 JP20000114830 申请日期 2000.04.17
申请人 SHIRAI TEKKOSHO:KK 发明人 SHIRAI AKIRA
分类号 C03B33/027;B65G49/06;C03B33/02;C03B33/037;(IPC1-7):C03B33/027 主分类号 C03B33/027
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