| 摘要 |
The electronic device comprises an electronic circuit carried on a metal leadframe (40). At least part of the package walls enclosing the circuit are formed by sections of the leadframe (53a,53b,57a,57b,58a,58b,55a,55b). The package may be made from a single-piece section of the leadframe. The electronic circuit is an integrated circuit. At least two packages may be provided for sub-circuits, both packages being made from a signal-piece section of the leadframe. The leadframe may include a heat sink. The leadframe may be enclosed in a moulding. |
