发明名称 PARTIAL PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a partial plating apparatus which plates gold only on an inner lead of a TAB frame. SOLUTION: This partial plating apparatus is provided with a mask I which has an opening part 9a which is opened so as to correspond to the region to be plated of the TAB frame and is disposed horizontally, an elevation means II which lowers the TAB frame 106 toward the mask I and a pressing means III which presses the TAB frame 106 to the mask I from above. Therein, plating liquid is ejected toward the opening part 9a from the lower part of the opening part 9a and the region to be plated is plated.
申请公布号 JP2001303297(A) 申请公布日期 2001.10.31
申请号 JP20000128375 申请日期 2000.04.27
申请人 SHINKO ELECTRIC IND CO LTD 发明人 IWAMOTO SHIGEKI
分类号 C25D5/02;C25D7/06;C25D7/12;C25D17/00;H01L21/60;H01L23/495;H05K3/18;(IPC1-7):C25D17/00 主分类号 C25D5/02
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