摘要 |
The semiconductor appliance has design modifications for solving the problem of the length of, and unequal length of the current paths, a problem that becomes more acute with the increasing number of semiconductor devices (chips) (24) mounted on the substrate (22,23). A first main current electrode (27) is connected in common with each of a number of semiconductor devices (chips) via the substrate, and a second main current electrode (25) is mounted opposite the first main current electrode and is connected in common with each of the number of semiconductor devices (chips). |