Verfahren und Vorrichtung zum nasschemischen Entfernen von Schichten und zur Reinigung von scheibenförmigen Einzelsubstraten

摘要

The invention relates to a method and a device for the wet-chemical removal of organic layers and particles from substrate surfaces (stripping and cleaning). According to said method, an individual substrate is introduced vertically into one or more processing baths which is/are filled with chemicals for carrying out chemical stripping and cleaning processes (filled with water for rinsing processes). The substrate is subsequently subjected to a physical cleaning process, in which the substrate surface is physically cleaned and the cleaned substrate is then dried in a drying device.