摘要 |
<p>PROBLEM TO BE SOLVED: To provide a transportation container for a semiconductor wafer package container to be used in transportation of containers of semiconductor wafers wherein the semiconductor wafers can be stably held for transportation even if the containers are stacked in multiple stages for transportation. SOLUTION: The transportation container houses and transports a plurality of package containers which house the semiconductor wafers, wherein the container is molded by reaction-injection-molding of polydicyclopentadiene and comprises reinforcement ribs 121, 142, 151, 152, 161, 162.</p> |