| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition which is heat-resistant and has a small coefficient of linear thermal expansion and to provide a laminate for printed circuits excellent in heat resistance and through hole reliability and suitable for a semiconductor package substrate such as a CSP or a BGA. SOLUTION: The resin composition essentially contains (A) a maleimide compound and (B) a naphthalene-type epoxy resin prepared by the reaction of a specific tetravalent naphthol compound, e.g. 1,1'-methylenebis(2,7- dihydroxynaphthalene), with epihalohydrin. A cured item, a prepreg for laminates, and a printed circuit substrate prepared by integrally press molding the prepregs under heating are also provided.
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