发明名称 |
Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
摘要 |
A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips. <IMAGE> |
申请公布号 |
EP1150552(A2) |
申请公布日期 |
2001.10.31 |
申请号 |
EP20010109863 |
申请日期 |
2001.04.23 |
申请人 |
SONY CORPORATION |
发明人 |
NISHIYAMA, KAZUO;OZAKI, HIROSHI;TAKAOKA, YUJI;HIRAYAMA, TERUO |
分类号 |
H01L21/683;H01L21/301;H01L21/48;H01L21/56;H01L21/60;H01L21/68;H01L23/12;H01L23/31;H01L23/485 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|