INSPECTION DEVICE AND METHOD FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inspection device and a method for a semiconductor device capable of exactly specifying a leak location by separately indicating the leak current from the normal current even in the case the leak location is covered with other wiring. SOLUTION: A magnetic field is impressed to a defective semiconductor device 15 as an inspection object by magnetic field generators 18 and 19. Current is sent from a power source 17 to the wiring of the semiconductor device 15. Stress generated in the wiring is detected with a stress detector 21 to produce the first stress image. Then the second stress image for comparison is produced by inspecting a good semiconductor device and a difference image of the first and the second stress images is made with an image processor 25. The difference image is compared with a wiring pattern image of the semiconductor device 15.