发明名称 Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
摘要 In order to establish electrical contact and to conduct electrolytic treatment, especially electroplating of very thin, electrically conductive layers, primarily with a high electrolytic current, a device is used that comprises a contact carrier (4, 5, 10, 11), especially clamps, clips and the like, with contacting elements (8) for supplying current to the treatment product (6), wherein at least the contact surfaces of the contacting element (8) that are brought into contact with the treatment product are made from an elastic, electrically conductive material.
申请公布号 DE10019720(A1) 申请公布日期 2001.10.31
申请号 DE2000119720 申请日期 2000.04.20
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 HUEBEL, EGON
分类号 C25D17/08;C25D5/00;C25D17/06;H05K3/24;(IPC1-7):C25D17/06 主分类号 C25D17/08
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