| 摘要 |
PROBLEM TO BE SOLVED: To obtain an alkali development type photocurable/thermosetting resin composition having a large photo-curing depth in exposure, providing a cured material having a high resolution, excellent heat resistance, chemical resistance, electric characteristics, water vapor absorption resistance and PCT resistance, not causing mist in processes followed by heating. SOLUTION: This composition comprises (A) a photosensitive prepolymer containing two or more unsaturated double bonds and one or more carboxyl groups in one molecule, (B) at least one kind of a compound containing at least one group of an alkoxy, an aryloxy, an alkylthio, an arylthio, an alkylamino or an arylamino substituent group directly bonded to a phenyl or a benzoyl group bonded to an oxime functional group as a photopolymerization initiator, (B') another photopolymerization initiator except the photopolymerization initiator, (C) a reactive diluent and (D) an epoxy compound containing two or more epoxy groups in one molecule. The composition is preferably used as a solder resist and an interlaminar resin insulating layer. |
