| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of boundary scan tests regardless of kinds of device. SOLUTION: The semiconductor device 29 has a first integrated circuit device 1 in which an integrated circuit with a specific function is applied and a second integrated circuit device 2 connected to the first integrated circuit device 1 for inspecting a contact part of other parts by way of a solder junction part 12. |
