Production of gold wires used in the semiconductor industry comprises applying a solution onto a carrier material, removing the solvent, crushing the carrier material and treating with a reducing agent

摘要

Production of gold wires comprises applying a solution containing a compound containing gold ions, a compound containing halide ions, and optional additives onto a carrier material; removing the solvent; crushing the carrier material and treating with a reducing agent. Preferred Features: The mixture is applied to the carrier material using a sol-gel technique or by precipitation. The carrier material is made from SiO2, Al2O3, and/or an oxide of a transition metal. The additive is a halide, sulfide, phosphide, phosphate or nitrate. The halide ion is chloride. The compound containing gold ions is AuCl3 or HAuCl4.