METHOD OF APPLYING A PHASE CHANGE THERMAL INTERFACE MATERIAL

摘要

Application of a phase change thermal interface material to the heat transfer surface of an electronic component or thermal dissipation member such as a heat sink or spreader. The phase change material is provided for application as a fluent, curable composition which is an admixture of the material and a diluent which may be an organic solvent. The fluent composition is sprayed onto the heat transfer surface to cover at least a portion thereof. The deposited composition then is cured, such as by volatilization or other evaporation of the diluent, to form a film layer of the phase change material on the heat transfer surface. Preferably, such film layer is less than 2 mil (0.5 mm) thick.