发明名称 |
POLYPROPYLENE-BASED RESIN COMPOSITION AND MOLDING COMPRISING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition having excellent transparency, rigidity and processability in molding and excellent appearance of molding. SOLUTION: This polypropylene-based resin composition comprises 80-98 wt.% of a polypropylene-based polymer (1) having a melt tension (MT(190)) at 190 deg.C and MFR at 230 deg.C satisfying formula 1 MT(190)<7.52×MFR(-0.576) (formula 1) and 2.0-5.0 molecular weight distribution (Mw/Mn) and 2-20 wt.% of a polypropylene-based polymer (II) having MT(190) and MFR at 230 deg.C satisfying formula (2) MT(190)>=7.52×MFR(-0.576) (formula 2). The composition has 3.0 to 5.0 Mw/Mn of the whole polypropylene-based resin composition and >=3.8 MT(170) and satisfies formula 3 MT(170)-MT(190)>=1.4 (formula 3).
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申请公布号 |
JP2001302858(A) |
申请公布日期 |
2001.10.31 |
申请号 |
JP20000120544 |
申请日期 |
2000.04.21 |
申请人 |
SUMITOMO CHEM CO LTD |
发明人 |
OBATA YOICHI;SHIRATANI EISUKE;KITANO KATSUHISA |
分类号 |
C08J5/00;C08J5/18;C08L23/10;(IPC1-7):C08L23/10 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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