| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a grinding composition which can strongly grind, gives ground surfaces having excellent smoothness and uniformity, and is especially useful for grinding semiconductor substrate materials and glass materials, and to provide a method for grinding. SOLUTION: This composition for grinding, characterized by comprising silica-containing abrasive grains, a fluorine-containing compound having a hydroxyl group and a fluorinated hydrocarbon group, and water, wherein the content of the silica-containing abrasive grains is 1 to 40 wt.% and the fluorine- containing compound is 0. 005 to 2.0 wt.%.</p> |
