发明名称 METHOD FOR COUPLING SEPARATED PCB WITH CHASSIS AND MODULE THEREOF
摘要 PURPOSE: A method for coupling a separated PCB(Printed Circuit Board) with a chassis and a module thereof are provided to couple simply plural PCBs to each other by coupling concave connecting portions and convex connection portions of plural PCBs and performing a soldering process. CONSTITUTION: A first signal pattern is printed on a first PCB(PCB1). A second signal pattern is printed on a second PCB(PCB2). A third signal pattern is printed on a third PCB(PCB3). A convex portion is formed by cutting a coupling part of the first PCB(PCB1) having the signal pattern. A concave portion is formed by cutting a coupling part of the second PCB(PCB2) having the signal pattern. The convex portion of the first PCB(PCB1) is coupled with the concave portion of the second PCB(PCB2). The first and the second PCBs(PCB1,PCB2) are combined with a chassis(21) by forming a solder land on the coupled portion between the convex portion and the concave portion of the first and the second PCBs(PCB1,PCB2). The first and the second PCBs(PCB1,PCB2) are coupled to each other by using a signal pattern connection portion(22). The first to the third PCBs(PCB1-PCB3) are arranged on one chassis(21). The chassis(21) is connected to the first to the third PCBs(PCB1-PCB3) by using a PCB connection portion(23).
申请公布号 KR100314633(B1) 申请公布日期 2001.10.31
申请号 KR19970023112 申请日期 1997.06.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, JAE HONG
分类号 H05K7/00;(IPC1-7):H05K7/00 主分类号 H05K7/00
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