发明名称 |
Method and device for laser cutting microscopic samples |
摘要 |
The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself. |
申请公布号 |
AU7383801(A) |
申请公布日期 |
2001.10.30 |
申请号 |
AU20010073838 |
申请日期 |
2001.04.10 |
申请人 |
LEICA MICROSYSTEMS WETZLAR GMBH |
发明人 |
MICHAEL GANSER;ALBRECHT WEISS;RUDIGER STENZEL |
分类号 |
G01N1/06;B23K26/00;B23K26/066;G01N1/04;G01N1/28;G02B21/32 |
主分类号 |
G01N1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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