发明名称 Method and device for laser cutting microscopic samples
摘要 The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself.
申请公布号 AU7383801(A) 申请公布日期 2001.10.30
申请号 AU20010073838 申请日期 2001.04.10
申请人 LEICA MICROSYSTEMS WETZLAR GMBH 发明人 MICHAEL GANSER;ALBRECHT WEISS;RUDIGER STENZEL
分类号 G01N1/06;B23K26/00;B23K26/066;G01N1/04;G01N1/28;G02B21/32 主分类号 G01N1/06
代理机构 代理人
主权项
地址