发明名称 RESIN SEALING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing apparatus made possible to respond to the production increase of a molded article accompanied by the increase of a press part by speeding up the taking-out and housing operation for the molded article. SOLUTION: The molded article is delivered to a transfer means standing by at a molded article taking-out part 18 from a molded article housing unit B by an unloader 15 performing only the delivery of the molded article taken out of the press part and the transfer means is moved in reciprocating manner from the molded article taking-out part 18 to the molding housing part 21 for housing the molded article through a degate part 20 where a gate break is performed.
申请公布号 JP2001300976(A) 申请公布日期 2001.10.30
申请号 JP20000121022 申请日期 2000.04.21
申请人 APIC YAMADA CORP 发明人 WAKABAYASHI TAKESHI;HIRANO JUNJI
分类号 B29C45/14;B29C45/17;H01L21/56;(IPC1-7):B29C45/14 主分类号 B29C45/14
代理机构 代理人
主权项
地址