发明名称 Substrate for high-voltage modules
摘要 A metallic-ceramic substrate having a ceramic layer and metal layers on both sides of the ceramic layer is provided with a high-impedance layer at the surface of the ceramic layer. The high-impedance layer is located adjacent to the metal layers. Therefore, the electrical field intensity at the edges of the metal layers is limited and an even distribution of the electrical potential at the surface of the ceramic layer is achieved. For example, the high-impedance layer may include a thin CrNi-layer, a doped Si-layer, an a-C:H-layer or a Ti-implantation.
申请公布号 US6310401(B1) 申请公布日期 2001.10.30
申请号 US20000607053 申请日期 2000.06.29
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 STOISIEK MICHAEL;LEFRANC GUY;BAYERER REINHOLD;LEUSCHNER RAINER
分类号 H05K3/46;H01L23/498;H01L23/60;H01L25/07;H01L25/18;H05K1/02;H05K1/03;H05K1/16;H05K3/40;(IPC1-7):H01L29/40 主分类号 H05K3/46
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