| 发明名称 |
Circuit substrate |
| 摘要 |
A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.
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| 申请公布号 |
US6309737(B1) |
申请公布日期 |
2001.10.30 |
| 申请号 |
US20000578451 |
申请日期 |
2000.05.26 |
| 申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
HIRASHIMA YUTAKA;TANIGUCHI YOSHITAKA;HUSHII YASUHITO;TUJIMURA YOSHIHIKO;TERANO KATSUNORI;GOTOH TAKESHI;TAKAKURA SYOJI;YOSHINO NOBUYUKI;SUGIMOTO ISAO;MIYAI AKIRA |
| 分类号 |
H01L25/00;C04B37/02;H01L23/15;H01L23/373;H05K3/00;H05K3/38;(IPC1-7):B32B3/00 |
主分类号 |
H01L25/00 |
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