| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder supply device and a solder supply method by which a container with a low cost, containing fluidized solder can be easily set and the solder can be used from the container without leaking. SOLUTION: When supplying the fluidized solder contained in the container to the side to be supplied from a solder discharge port provided on the lower part of the container, the container containing the solder is mounted slantwise on a base 110. By moving a first pressure member 130, a pressure is applied by pushing the container on the base, and the solder in the container is pushed out from the solder discharge port. When the movement of the first pressure member is stopped, by moving a second pressure member 160, the vicinity of the solder discharge port of the container on the base is pushed, and the solder discharge port is closed.
|
