| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin metal foil fixed to a carrier layer in a peelable state, a metal foil/carrier layer composite, a method for manufacturing the composite and a thin copper foil laminated to a dielectric base material used for manufacturing a printed circuit board and a flexibl circuit. SOLUTION: The metal foil/carrier layer composite includes the structural carrier layer (12) and the relatively thin metal foil layer (14) between which a peel layer (16) is held. The peel layer (16) may comprise a mixture of a metal and a nonmetal and, when the metal foil layer (14) is peeled from the carrier layer (12), peel force of 1.79-35.7 kg/m is generally applied to the peel layer (16) and adhesive strength preventing the peeling of the metal foil layer (14) before use and sufficient to easily remove the carrier layer (12) if necessary is imparted to the peel layer (16).
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