| 摘要 |
The present invention provides a fingerprint sensor chip formed on a dielectric layer of a semiconductor wafer. The fingerprint sensor chip comprises a plurality of rectangular sensor areas arranged in a matrix format which are surrounded by conductors, a second dielectric layer covering the sensor areas and the conductors wherein the surface of the second dielectric layer positioned above each of the sensor areas is formed as a protruding rectangular platform with a shallow trench around the platform, a rectangular metal plate positioned on top of each of the rectangular platforms which is used as a sensor plate of the fingerprint sensor chip, and a protective layer positioned on the surface of the semiconductor wafer to cover and protect the underlying circuitry.
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