发明名称 |
Semiconductor integrated circuit device |
摘要 |
A semiconductor integrated circuit device having a ball grid array package includes a core material including a semiconductor chip and a sealing resin layer surrounding the chip and surface materials including a carrier base and a reinforcement in a sandwich structure for high stiffness against being and high reliability of connection to a printed wiring board even during heat cycling.
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申请公布号 |
US6308938(B1) |
申请公布日期 |
2001.10.30 |
申请号 |
US19980016398 |
申请日期 |
1998.01.30 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
FUTAKUCHI MICHIO |
分类号 |
H01L23/12;H01L23/16;H01L23/31;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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