| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux material for providing a semiconductor device which is highly reliable like heretofore and is low in a cost in a method for sealing a semiconductor element, more preferably a semiconductor element having soldered electrodes on a circuit surface by using an underfill material. SOLUTION: In the area packaging method for treating the soldered electrodes of the semiconductor element included with the soldered electrodes or the circuit surface of the circuit board with the flux material, then connecting the soldered electrodes and the circuit surface of the circuit board, this flux material consists of a compound which has a flux effect and has a functional group reacting with at least bi- or higher functional epoxy groups. |
