发明名称 |
Transfer molding method for forming integrated circuit package |
摘要 |
A method and resulting integrated circuit package is disclosed for encapsulating integrated circuit chips using transfer molding techniques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit board/card and the contacts are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carrier. Liquid plastic is forced into the cavity via a runner in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components.
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申请公布号 |
US6309575(B1) |
申请公布日期 |
2001.10.30 |
申请号 |
US19990291131 |
申请日期 |
1999.04.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BOUTIN LYNDA;LETOURNEAU MARTIAL A.;TETREAULT REAL |
分类号 |
B29C45/26;B29C45/02;B29C70/70;B29L31/34;H01L21/56;H01L23/02;H01L23/12;H01L23/24;H01L23/29;H01L23/50;(IPC1-7):B29C70/70 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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