发明名称 |
Method of manufacturing a wafer fabricated electroacoustic transducer |
摘要 |
A method is disclosed for simultaneously producing a plurality of capacitive electroacoustic transducers. The method comprises forming a plurality of electrically insulative substrates by cutting circular slots to an insulating wafer. Each slot is interrupted by at least two tabs connecting a circular area with the remainder of the wafer. The conductive diaphragms are supported on diaphragm mounting rings disposed upon the substrate, spaced from a first electrode. The mounting rings space the diaphragm from the electrode to define a capacitor operative to convert electrical and acoustical signals.
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申请公布号 |
US6308398(B1) |
申请公布日期 |
2001.10.30 |
申请号 |
US19990459223 |
申请日期 |
1999.12.10 |
申请人 |
NORTHROP GRUMMAN CORPORATION |
发明人 |
BEAVERS BOB RAY |
分类号 |
G01L9/12;H04R1/00;H04R19/04;H04R31/00;(IPC1-7):H04R31/00;H01G7/00 |
主分类号 |
G01L9/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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