发明名称 |
High speed flip chip assembly process |
摘要 |
A method is provided to assemble flip chips to an electronic circuit using a printable anisotropic conductive adhesive or paste. The invention is especially useful to assemble flip chips or other components to an array of circuits provided within a large area format. The circuits in a preferred embodiment are disposable radio frequency identification devices (RFID) or Smart Cards. |
申请公布号 |
AU5314201(A) |
申请公布日期 |
2001.10.30 |
申请号 |
AU20010053142 |
申请日期 |
2001.04.04 |
申请人 |
PARLEX CORPORATION |
发明人 |
DAVID M. PRICE;CHRISTOPHER J. PIACITELLI;GARY R. LARSON;SHAUN HUOT;JAMES S. HAMMOND;MIAO-YONG CAO;BRUCE P. MAHAN;JOHN G. WISTEY |
分类号 |
G06K19/077;H05K1/09;H05K1/16;H05K3/46 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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