| 摘要 |
This invention relates to the resin encapsulation of solenoids to achieve water resistance at pressure depth. When a compatible and bondable resin is used to form a solenoid bobbin, to insulate the lead-in wires and to encapsulate the solenoid, the resulting encapsulation is effective in resisting water penetration. The formation of bonds between the encapsulation and the solenoid bobbin flanges and insulated lead-in wires allows the encapsulated solenoid to resist water penetration and to operate efficiently in underwater environments.
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