Method for securing and processing thin film materials

摘要

To secure a thin film to a rigid carrier for subsequent exposure to processing chemicals, the thin film is initially adhered to the rigid carrier with a light adhesive from which the thin film may later be peeled. Then a photoresist is applied over the thin film extending over a peripheral region of the carrier along the perimeter of the thin film. The photoresist is exposed to actinic radiation in a pattern such that when the photoresist is subsequently developed, a perimeter region of the photoresist remains over the perimeter region of the carrier and extending inward over the periphery of the thin film sufficiently to secure the thin film during conveyorized chemical processing. Finally the resist is stripped to release the thin film and the thin film pealed from the adhesive pattern.