发明名称 MOLDING DEVICE FOR SYNTHETIC RESIN WIRE
摘要 PROBLEM TO BE SOLVED: To continuously mold a long-sized synthetic resin wire by reducing an intermediary of hand as much as possible in the case of molding the wire in an object shape. SOLUTION: The molding device A comprises a heater B for heating a long- sized wire 1, a drawing unit C for drawing the heated wire 1 in a preset length, a cutter D for cutting the drawn wire 1, a mold E having a molding groove 32 formed between upper mold 21 and a lower mold 22 to mold the wire 1 by holding the wire 1 in the groove 32, a supply unit F for supplying the wire 1 to the mold E, a transfer unit G for transferring the mold E, and a taking-out unit H for taking out the held wire 1 by opening the mold E.
申请公布号 JP2001301021(A) 申请公布日期 2001.10.30
申请号 JP20000122081 申请日期 2000.04.24
申请人 OKUTO:KK 发明人 FURUYA MASAYOSHI;KANBARA TADAYUKI
分类号 B29C53/02;B29C53/80;(IPC1-7):B29C53/02 主分类号 B29C53/02
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